IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis on the abilities of solder joints to resist thermal fatigue and service life prediction

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xuexia Yang ; Bo Wang ; Yu Zhang ; Xuefeng Shu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,147 - 1,150
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582747
Regular:

The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First,... View More

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