IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental study on the effect of reflow soldering temperature profile on the solder joint shape

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Bo Wang ; Xuexia Yang ; Yu Zhang ; Xuefeng Shu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,128 - 1,131
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582741
Regular:

In this paper, Surface mount experiment of Sn-Pb and Lead-Free solder joints under different thermal reflow profile was aimed at statistical analysis of the reflowed cross-section contour and... View More

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