IEEE - Institute of Electrical and Electronics Engineers, Inc. - The influence of standoff height and pad size on the Shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Li Xun-Ping ; Xia Jian-Min ; Zhou Min-Bo ; Ma Xiao ; Zhang Xin-Ping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,118 - 1,123
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582738
Regular:

The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated... View More

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