IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability study on high density LED packaging with Chip On Board structures

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yang Hai ; Yang, D. ; BoWei Li ; Zhi You ; YaHui Ma ; DoingJing Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,102 - 1,107
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582734
Regular:

In this paper an improved LED (Light emitting diode) packaging structure was proposed, which is based on COB (Chip On Board) technology. This research mainly analyzed the thermal reliability of a... View More

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