IEEE - Institute of Electrical and Electronics Engineers, Inc. - The study of flip-chip Cu stud bump's reliability based on PCA-BP neural networks

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhang Shan-shan ; Zhang Chang-ying ; Zhang Jing ; Mu Wei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,093 - 1,096
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582731
Regular:

In this paper, the model of Cu stud bump is established by ANSYS/LS-DYNA, and under different parameters such as: the chopper, copper wire diameter and pad size and so on, simulate the process of... View More

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