IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of recrystallization in BGA package to evaluate the low Ag solder with different dopants after board level test

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chi-Ko Yu ; Chang, G. ; Shao, T. ; Chen, C. ; Lee, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,069 - 1,072
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582723
Regular:

The benefits shown in the reliability performance when using the low Ag solder in BGA package has been known due to its intrinsic characteristic. In this study, SAC alloy with the dopant D1 and D2... View More

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