IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of combining hygro-thermal stress on reliability of plastic QFN package

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Hailong Liu ; Shaohua Yang ; Guoyuan Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,059 - 1,063
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582720
Regular:

In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion,... View More

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