IEEE - Institute of Electrical and Electronics Engineers, Inc. - System level drop reliability method research for netbook memory module

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Minyi Lou ; Jianwei Zhou ; Long Wen ; Weiwei Feng ; Jaisung Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,043 - 1,048
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582716
Regular:

Prevalence of portable devices such as netbook led to increased concerns on drop reliability of FBGA. In order to investigate drop reliability, board level drop test according to Jedec is done in... View More

Advertisement