IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on heat dissipation in Package-on-Package (POP)

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xiang Qiu ; Jun Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 753 - 757
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582707
Regular:

Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was greatly improved by the 3D packaging technologies. Package-on-package... View More

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