IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical performance analysis of compliant wafer level package (CWLP) with embedded air-gaps

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jing Liu ; Kai-lin Pan ; Jiao-pin Wang ; Jing Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 767 - 770
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582705
Regular:

A good solution to meet the need of miniaturization and low cost for micro-electronics packaging is wafer level package technology. But thermal mechanical reliability problem which generated from... View More

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