IEEE - Institute of Electrical and Electronics Engineers, Inc. - Test and assessment of the heating system of reflow ovens

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wang Yuming ; Cui Zengwei ; Wang Beibei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 798 - 804
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582693
Regular:

As the point interconnects between printed circuit board (PCB) and chips and owning a soft constitutive material property, solder joint interconnect is the crucial link for reliability of... View More

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