IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and characterization of the bonding-wire interconnection for microwave MCM

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Liang Ying ; Huang ChunYue ; Wang Wangang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 810 - 814
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582690
Regular:

The 3-D electromagnetic software Ansoft HFSS is adapted to modeling analysis and simulation optimization about the microwave characteristics of bonding interconnection in the MMCM. The gold bond... View More

Advertisement