IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study of signal integrity for PCB level

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jiang Jing ; Kong Lingwen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 828 - 833
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582684
Regular:

With the rapid development of high-speed digital circuits and high-integration-chip technology, more high-speed signals need to be transferred in high-speed interconnection. However,... View More

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