IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical design of high density low cost package for a switch ASIC

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jun Li ; Liqiang Cao ; Shuhua Liu ; Jing Zhou ; Qidong Wang ; Guidotti, D. ; Lixi Wan ; Cheng Liao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 548 - 551
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582680
Regular:

A switch Application Specific Integrated Circuit (ASIC) chip implemented in six-substrate layers for low cost design which has more than 1000 pin-count. This paper deals with the electrical design... View More

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