IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal stress analysis of PBGA using a fluid-solid coupling method under steady convective heat transfer

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhimin Wan ; Xiaobing Luo ; Sheng Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 525 - 529
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582675
Regular:

As the power density enhances while package size decreases, thermal management becomes a primary concern of the reliability and performance of the electronic packaging. When the natural convective... View More

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