IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer level package for the X-band microwave power sensor

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): De-bo Wang ; Xiao-ping Liao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 530 - 533
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582671
Regular:

A wafer level packaging solution for the X-band microwave power sensor is described based on through wafer via technology in silicon substrate in this paper. The connection between chip and... View More

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