IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stress analysis of Cu pad/solder interfaces

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wang Zhuoru ; Qin Fei ; Xia Guofeng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 515 - 519
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582668
Regular:

Interfacial fracturing is the most important failure mode of solder joints. In this paper, interfacial stresses of Cu pad/solder interfaces are evaluated based on the theory of interfacial... View More

Advertisement