IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental research on Sn99.0/Ag0.3/Cu0.7 lead-free soldering paste and its board-level packaging joint reliability

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)

Author(s): Lei Yong Ping ; Lin Jian ; Fu Han Guang ; Wu Zhong Wei ; Wang Yong ; Li Ke ; Liao Gao Bing
Sponsor(s): Electron. Manuf. & Packag. Technol. Soc. of the Chinese Inst. of Electron., China
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China
Conference Date: 16 August 2010
Page(s): 935 - 937
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582650
Regular:

For the increase market demand of low- Ag lead-free solder paste, a rosin-based halogen-free flux which is suitable for low-Ag lead-free solder past Sn99.0/Ag0.3/Cu0.7 has been developed. Its... View More

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