IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jian Zou ; Liping Mo ; Fengshun Wu ; Bo Wang ; Hui Liu ; Jun Zhang ; Yiping Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 944 - 948
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582647
Regular:

Effect of Cu substrates and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging was investigated. Solder joints with three types of Cu bonding pads... View More

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