IEEE - Institute of Electrical and Electronics Engineers, Inc. - Genetic-algorithm- annealing-algorithm-based scheme for MCM interconnect test

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chen Lei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 973 - 976
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582639
Regular:

A novel optimization scheme based on genetic algorithm (GA) and simulated annealing algorithm (SA) is presented for the Multi-chip Module (MCM) interconnect test generation problem in this paper.... View More

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