IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of FEM simulation technology on thermal design of electronic packaging device

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Song Fang fang ; Lai Ping ; Feng Xian-long ; He Xiao-qi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 977 - 979
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582635
Regular:

Thermal design is necessarily to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of packaging device was studied using FEM, for example,... View More

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