IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on intelligent detecting technology for solder joint quality of SMT based on fuzzy diagnosis technique

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chen Xiaoyong ; Zhou Dejian ; Wu Zhaohua ; Li Chunquan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 989 - 992
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582633
Regular:

The paper proposes a method that realized the solder joints assembly quality fault diagnosis. After an analysis of fuzzy fault diagnosis principle of SMT products, geometrical shape parameters... View More

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