IEEE - Institute of Electrical and Electronics Engineers, Inc. - The effects of response features on failure modes of board level drop impact test

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Liu, Y. ; Sun, F.L. ; Kessels, F.J.H.D. ; van Driel, W.D. ; Zhang, G.Q.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 984 - 988
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582632
Regular:

Portable electronic products are getting popular during last decade. One of the most common failures for a mobile device is related to the accidental drop impact during daily usage. In this paper,... View More

Advertisement