IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interface toughness characterization in microelectronic packages based on four point bending test and simulation

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Ma Ya-hui ; Ma Xiao-song ; Zhou Peng ; Hai Yang ; You Zhi ; Liu Dong-Jing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 993 - 997
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582629
Regular:

Microelectronic packaging devices consist of various kinds of materials, such as: die, molding compound, adhesives, copper etc. Due to the mismatch of the materials coefficient of thermal... View More

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