IEEE - Institute of Electrical and Electronics Engineers, Inc. - Failure behavior and life prediction of through-hole solder joints under thermal cycling

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Hui Xiao ; Xiaoyan Li ; Na Liu ; Yongchang Yan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,007 - 1,012
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582627
Regular:

Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air... View More

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