IEEE - Institute of Electrical and Electronics Engineers, Inc. - Determining parameter of solder joint defect characterization based on correlation analysis

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Huang ChunYue ; Wang Wangang ; Liang Ying ; Li Tianming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,003 - 1,006
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582626
Regular:

The relationship between surface mount component solder joint section area and solder defect, section height and solder defect, contact angle and solder defect were studied respectively. By using... View More

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