IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of protection atmosphere's temperature on morphology of Au-Sn IMCs in laser reflowed micro-solder joints

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wei Liu ; Chunqing Wang ; Lining Sun ; Yanhong Tian
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 442 - 445
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582548
Regular:

Formation of AuSnx IMCs in laser reflowed solder joints protected by N2 atmosphere at room temperature, 60°C, 100°C and 130°C was investigated respectively. The solder balls were... View More

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