IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer Level Camera technology - from wafer level packaging to wafer level integration

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Hongtao Han ; Kriman, M. ; Boomgarden, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 121 - 124
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582473
Regular:

Increasing demand from consumers to integrate camera modules into electronic devices, such as cell phones, has driven the cost of camera modules down very rapidly. Now that most cell phones... View More

Advertisement