IEEE - Institute of Electrical and Electronics Engineers, Inc. - A pre-shaped wafer level packing strategy for RF MEMS

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xiang Li ; Zewen Liu ; Zheng Wang ; Yongqiang Huang ; Ling Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 135 - 137
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582466
Regular:

A pre-shaped wafer level packaging strategy for RF MEMS is presented. Silicon wafer is used as the capping chip for packaging of the Coplanar Waveguide (CPW) lines on the SCHOTT... View More

Advertisement