IEEE - Institute of Electrical and Electronics Engineers, Inc. - Green flame retardance of epoxy molding compound for large-scale integrated circuit packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yang Ming-shan ; Liu Jian-wei ; Li Lin-kai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 142 - 144
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582463
Regular:

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