IEEE - Institute of Electrical and Electronics Engineers, Inc. - Solid state reaction of Sn3.0Ag0.5Cu solder with Cu(Mn) under bump metallization

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chien-Fu Tseng ; Jenq-Gong Duh ; Su-Yueh Tsai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 152 - 155
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582461
Regular:

In flip chip technology, Cu thin-film is a widely used under bump metallization (UBM). However, the major disadvantages of Cu UBM are fast consumption of copper, rapid growth of IMCs and easy... View More

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