IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of green molding compound for high voltage discrete package

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Guangchao Xie ; Jianhua Ruan ; Yue Wang ; Xinyu Du ; Xingming Cheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 148 - 151
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582460
Regular:

The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power... View More

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