IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on preparation and properties of epoxy resin modified by amine-terminated polyimide as electronic packaging materials

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xin Miao ; Dayong Gui ; Guangfu Zeng ; Jianhong Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 160 - 164
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582458
Regular:

In this research, epoxy resin was modified by amine-terminated polyimide (ATPI) prepolymer for improving both thermal and mechanical properties of electronic packaging materials. The ATPI was... View More

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