IEEE - Institute of Electrical and Electronics Engineers, Inc. - Orientation relationships among Sn/Cu 6 Sn 5 /Cu 3 Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Pan-Ju Shang ; Zhi-Quan Liu ; Douxing Li ; Jian-Ku Shang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 165 - 169
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582454
Regular:

TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between... View More

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