IEEE - Institute of Electrical and Electronics Engineers, Inc. - Morphology and growth mechanisms of SAC305-xNi/pad joints intermetallic compounds

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Lifeng Wang ; Jia Wang ; Xue Liu ; Xiaojing Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 181 - 184
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582452
Regular:

The formation and growth of intermetallic compounds (IMC) is a key factor to the reliability of soldering joints in modern electronic mounting and packaging industry. In this paper, by means of... View More

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