IEEE - Institute of Electrical and Electronics Engineers, Inc. - New fast curing isotropic conductive adhesive for electronic packaging application

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wenhui Du ; Chune Fu ; Si Chen ; Huiwang Cui ; Xiaohua Liu ; Tianan Chen ; Liu, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 199 - 201
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582446
Regular:

With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential... View More

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