IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability characterisation of Bi-modal high temperature stable Isotropic Conductive Adhesives

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wenkai Tao ; Si Chen ; Xiaohua Liu ; Huiwang Cui ; Tianan Chen ; Liu, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 225 - 228
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582437
Regular:

Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far... View More

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