IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multi-pulse electrodeposition of soft magnetic thin film Co-P for embedded inductor application

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yanqiu Li ; Liangliang Li ; Cai, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 220 - 224
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582436
Regular:

Electrodeposited Co-P thin film has recently attracted a lot attention due to its good high-frequency performance, large magnetic susceptibility, relatively high resistivity and growth rate. Co-P... View More

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