IEEE - Institute of Electrical and Electronics Engineers, Inc. - A study of high-density embedded capacitor for silicon-substrate package

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Huijuan Wang ; Fengwei Dai ; Guidotti, D. ; Yao Lv ; Liqiang Cao ; Lixi Wan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 843 - 846
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582412
Regular:

Rapidly growing performance and mixed-signal integration is driving the need for product component miniaturization in electronics applications. Embedded passive technology is a potentially... View More

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