IEEE - Institute of Electrical and Electronics Engineers, Inc. - Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Liqiang Zheng ; Mathewson, A. ; O'Flynn, B. ; Hayes, M. ; O'Mathuna, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 860 - 865
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582406
Regular:

A comparison study was carried out between a wireless sensor node with a bare die flip-chip mounted and its reference board with a BGA packaged transceiver chip. The main focus is the return loss... View More

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