IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on automatic angle correction directed by machine vision in power LED dies sorting

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Tao Wu ; Longwen Wang ; Kanghua Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 876 - 878
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582404
Regular:

All dies are required to keep consistent angles in LED chip sorting. Generally, all chips are adhesive to wafer tape. When each die rotates, all other dies rotate and their positions change. To... View More

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