IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of IMC thickness on fracturing of solder joints

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wang Chunke ; Qin Fei ; An Tong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 511 - 514
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582395
Regular:

Cracking along the intermetallic compound (IMC) interface in solder joints is the most important failure mechanism in electronics packages. In order to understand the failure mechanism well, a 2D... View More

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