IEEE - Institute of Electrical and Electronics Engineers, Inc. - An MCM package process for 24GHz driver amplifier using photosensitive BCB

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jiajie Tang ; Huajiang Wang ; Xiao Chen ; Wenguo Ning ; Gaowei Xu ; Xiaowei Sun ; Le Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 19 - 22
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582382
Regular:

This paper presents a wafer-level microwave multichip module (MMCM) packaging process for 24GHz driver amplifier using photosensitive-Benzocyclobutene (photo-BCB) of 25µm. It is developed... View More

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