IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of flip-chip interconnections of photodetector readout circuit (ROIC)

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Gaowei Xu ; Qiuping Huang ; Yuan Yuan ; Xiao Chen ; Le Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 31 - 33
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582375
Regular:

In this paper, the interconnection between 16×16 photodetector ROIC and substrate for the ROIC test was developed. Three kinds of substrate methods, i.e. high-density organic substrate, silicon... View More

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