IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced QFN packaging for low cost and solution

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)

Author(s): Bill C.J. ; Bruce Hu ; Mark Lin ; Timmy Lin ; Sunny Lee ; Yi-Shao Lai ; Andy Tseng
Sponsor(s): Electron. Manuf. & Packag. Technol. Soc. of the Chinese Inst. of Electron., China
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China
Conference Date: 16 August 2010
Page(s): 45 - 49
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582373
Regular:

The advanced QFN (aQFN) package is an enhanced version of conventional QFN (Quad Flat No-Lead) with multiple row terminals of featuring higher number of I/O ports. aQFN thermal and electrical... View More

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