IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of WLP with barrier trench structure in precision screen printing technology by glass frit

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xiao Chen ; Pei-li Yan ; Jia-jie Tang ; Wen-guo Ning ; Gao-wei Xu ; Le Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 71 - 73
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582363
Regular:

This paper reports on glass frit wafer bonding, which is a universally usable technology for Micro-Electronics Mechanical System (MEMS) wafer level encapsulation and packaging. The package process... View More

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