IEEE - Institute of Electrical and Electronics Engineers, Inc. - Co-design for thermal performance and mechanical reliability of flip chip devices

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Siew Hoon Ore ; Poh, S.W.E. ; Zhu, W.H. ; Yuan, W.L. ; Suthiwongsunthorn, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 81 - 87
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582361
Regular:

This paper presents the results of thermal performance and mechanical reliability co-design of flip chip devices by a comprehensive evaluation of package structure and material effects. The study... View More

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