IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical characterization of sidewall insulation layer of TSV

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xin Sun ; Ming Ji ; Shenglin Ma ; Yunhui Zhu ; Wenping Kang ; Min Miao ; Yufeng Jin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 77 - 80
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582360
Regular:

This paper presented a method to examine the electrical characteristics of sidewall insulation layer of through silicon via (TSV), including breakdown voltage and sidewall capacitance. Blind via... View More

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