IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging of high power semiconductor laser arrays using a novel macro-channel cooler

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jingwei Wang ; Zhenbang Yuan ; Lu Guo ; Lingling Xiong ; Yanxin Zhang ; Chenhui Peng ; Xiaoning Li ; Xingsheng Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 92 - 97
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582358
Regular:

High power semiconductor laser arrays have been widely used in many fields, such as pumping solid state laser aerospace, industry, medicine and display. For many applications, high power... View More

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