IEEE - Institute of Electrical and Electronics Engineers, Inc. - Temperature effect on IMC growth behavior of thin film copper-aluminum system in electronic packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xuefei Ming ; Yi Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 371 - 375
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582355
Regular:

It is widely accepted that wire bonding is the predominant method for the area of microelectronic packaging. Currently, copper wire has been studied to substitute the gold and aluminum ones in... View More

Advertisement